【支援發表】IEEE OA期刊投稿優惠方案【Research Support】IEEE Open Access Publish Support
服務內容
自 2023 年起,本校通訊作者投稿 IEEE Fully OA 期刊可享 APC 優惠;自 2026 年起,投稿 IEEE OA 期刊(Fully OA 或 Hybrid OA)均可享優惠。
IEEE 各學會可視情況調整 APC 或提供會員特殊優惠,最終金額以 RSLC 系統顯示為準,每篇論文僅能選擇一種優惠方式。
符合投稿優惠條件
- 通訊作者必須為校內教職員或學生。
- 投稿時請使用NYCU信箱或Author Affiliation下拉式選單請選擇:National Yang Ming Chiao Tung University。(請勿使用校名簡稱、別稱或帶有學院/系
所/實驗室名稱之選項)。 - 文章被接受日期(Accepted Date)介於2026/1/1-2026/12/31,適用本
方案。
符合投稿期刊範圍
Fully OA(Gold OA)
- 包含跨領域綜合 OA 期刊(例如 IEEE Access)及各主題型 OA 期刊。
- APC 優惠價:USD 1,728(付款時依匯率折算為新臺幣)。
- 詳情請參閱2026年IEEE Fully OA期刊清單。
Hybrid OA(Hybrid Journals)
- 適用於混合型 OA 期刊。
- APC 優惠價:USD 2,240(付款時依匯率折算為新臺幣)。
- 不包含:彩色圖表費、額外頁數費、超頁費。
- 詳情請參閱2026年IEEE Hybrid OA期刊清單。
操作說明
Services
Since 2023, NYCU corresponding authors submitting to IEEE Fully OA journals have enjoyed APC discounts. Starting in 2026, submissions to any IEEE OA journals (Fully OA or Hybrid OA) are eligible for the discount.
Individual IEEE societies may adjust APCs or offer special member discounts at their discretion. The final amount displayed in the RSLC system prevails, and only one discount can be applied per article.
Eligibility for Submission Discounts
- Corresponding author must be a faculty, staff, or student at NYCU.
- Submission must use a NYCU email or select “National Yang Ming Chiao Tung University” as the affiliation.
- Article Accepted Date must be between Jan 1 – Dec 31, 2026.
Eligible Journals & APC
For 2026, eligible journals are mainly divided into two categories:
Fully OA (Gold OA)
- Includes cross-disciplinary OA journals (e.g., IEEE Access) and Topical OA journals.
- Discounted APC: USD 1,728 (converted to TWD at payment).
- See the 2026 IEEE Fully OA Journal List for details.
Hybrid OA (Hybrid Journals)
- Applies to hybrid OA journals.
- Discounted APC: USD 2,240 (converted to TWD at payment).
- Excludes: Color Figures Charges, Voluntary Page Charges, Overlength Page Charges.
- See the 2026 IEEE Hybrid OA Journal List for details.
Submission and Transaction Steps
Manuals for Submitting & Transaction Process
